- solder layer
- solder layer Lötschicht f
English-German dictionary of Electrical Engineering and Electronics. 2013.
solder layer
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Solder mask — or solder resist is a lacquer like layer of polymer that provides a permanent protective coating for the copper traces of a printed circuit board (PCB) and prevents solder from bridging between conductors, thereby preventing short circuits.… … Wikipedia
Bumpless Build-up Layer — or BBUL is a processor packaging technology developed by Intel. It is bumpless, because it does not use the usual tiny solder bumps to attach the silicon die to the processor package wires. It has build up layers, because is grown / built up… … Wikipedia
Thermal copper pillar bump — The Thermal Copper Pillar Bump, also known as the thermal bump , is a thermoelectric device made from thin film thermoelectric material embedded in flip chip interconnects (in particular copper pillar solder bumps) for use in electronics and… … Wikipedia
Flux (metallurgy) — Rosin used as flux for soldering A flux pen used f … Wikipedia
Printed circuit board — Part of a 1983 Sinclair ZX Spectrum computer board; a populated PCB, showing the conductive traces, vias (the through hole paths to the other surface), and some mounted electrical components A printed circuit board, or PCB, is used to… … Wikipedia
Gold plating — is a method of depositing a thin layer of gold onto the surface of another metal, most often copper or silver, by chemical or electrochemical means.Mechanical or chemical affixing of thin gold foils onto the surface of objects is instead known as … Wikipedia
Soldering — For the song, see Soldering (song). For the product, see Solder. Desoldering a contact from a wire. Soldering is a process in which two or more metal items are joined together by melting and flowing a filler metal (solder) into the joint, the… … Wikipedia
Dell Inspiron — Logo Dell s Inspiron computer product line started as a range of laptop computers targeted at the entry level, budget, a Mobile Celeron or Mobile Pentium II processor with SDRAM, and had a high starting price of $2,799. Today, though, the… … Wikipedia
Thermal management of high power LED — With the coming of energy saving era, high power light emitting diodes (LEDs) are promising to replace other technologies such as incandescent and fluorescent bulbs in signaling, solid state lighting, and vehicle headlight applications due to… … Wikipedia
Electromigration — is the transport of material caused by the gradual movement of the ions in a conductor due to the momentum transfer between conducting electrons and diffusing metal atoms. The effect is important in applications where high direct current… … Wikipedia
Occam Process — The Occam Process is a solder free, Restriction of Hazardous Substances Directive (RoHS) compliant method for use in the manufacturing of electronic circuit boards and was developed by Verdant Electronics. It combines the usual two steps of the… … Wikipedia
